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A600 Series Semicon AOI
A600 Series Semicon AOI
Ultra flexible All in One AOI for every process in semiconductor advanced packaging manufacturing.
Comes with auto loading/unloading, automatic inspection and classification, automatic reject and automatic upload of inspection data to server.
Main Highlights A600 Series:
Main Highlights A600 Series:
Supports Lead Frame Inspection, Die Bond Inspection , Wirebond Inspection & After Mould Inspection.
Automatic loading and conversion based on recipes.
Customizable Loading & Unloading.
Customizable Reject Mechanism.
Supports Multi Size Units / Packages.
Super-fast Inspection speed with real-time Z Height compensation.
High Megapixels Camera Options (25MP, 50MP, 100MP)
Customizable inspection requirements with Optional Side View & Bottom View, Simultaneous Inspection.
Barcode trace & SecsGEM ready.
A600-A Semicon AOI
A600-A Semicon AOI
Hybrid AI
Hybrid AI
Uses advanced AI learning model to make setup easier, faster and simpler.
Hybrid CPU & GPU
Hybrid CPU & GPU
Fully utilises the power of latest CPU and GPU for 2D and 3D algorithms.
Contact Us
Address:
37 Persiaran Mutiara 2, Pusat Komersial Bandar Tasek Mutiara, 14120 Simpang Ampat, Pulau Pinang, Malaysia.
Tel:
+604-5269151
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