Measurement Coverage: Bond offset, wire path measurements, 3D wire sway, Die offset, Wire Drop, Wire width

Detection Coverage: Broken Wire, Sway wire, Short, Bond defects, Die cracks, Contamination on Die, Die chipping,  Foreign Material Inspection,  Die underfill, Die overfill

Wire tracing is the most important factor in wirebond inspection. ABW’s Wire-Trace technology uses own proprietary image processing algorithms to find the true path of each wires.

Prevent false calls caused by wrong wire tracing and correctly classify wire defects back to it’s intended wire for better troubleshooting on wirebonding process.

Prevents leak-through defects.

Wire-Trace technology most needed on packages with stacked wires, near wires, crossed wires, sweeping wires products.